The Effects of Mechanical, Thermal, and Electrochemical Pretreatments for a Copper Substrate on the Porosity of a Gold Electrodeposit
Author:
Publisher
Informa UK Limited
Subject
Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,Condensed Matter Physics
Link
https://www.tandfonline.com/doi/pdf/10.1080/00202967.1970.11870138
Reference29 articles.
1. The Causes of Porosity in Electrodeposited Coatings, Especially of Nickel on Steel
2. The Influence of Pre-Plating Processes on the Porosity of Electrodeposits on Steel
3. The Effects of Plating Conditions on Porosity in Gold Electrodeposits
4. The Porosity of Gold Electrodeposits
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1. Plated Coatings*;Shreir's Corrosion;2010
2. Electrodeposition of Metals and Alloys;Materials Science and Technology;2006-09-15
3. The Distribution of Pore Precursor Sizes in Copper Substrates and the Rate of Pore Closure in a Gold Electrodeposit;Transactions of the IMF;1974-01
4. The Mode of Pore Closure in Gold Electrodeposits;Transactions of the IMF;1973-01
5. The Relation between Porosity of a Gold Electrodeposit and Plating Conditions of a Copper Undercoat;Transactions of the IMF;1972-01
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