Study of a system for creating a statistical model of the electroless plating of Cu-Ni-P alloys-Reference-Cited by-同舟云学术

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Study of a system for creating a statistical model of the electroless plating of Cu-Ni-P alloys

Published:2022-08-17 Issue:6 Volume:100 Page:318-323
ISSN:0020-2967
Container-title:Transactions of the IMF
language:en
Short-container-title:Transactions of the IMF

Author:

Georgieva Mihaela G.¹²^ORCID

Affiliation:

1. Department of Chemistry, Faculty of Electronic Engineering and Technologies, Technical University of Sofia, Sofia, Bulgaria

2. Department of Electrochemistry and Corrosion, Institute of Physical Chemistry, Bulgarian Academy of Sciences, Sofia, Bulgaria

Funder

Scientific and Research Sector

Technical University of Sofia

National Science Fund

Publisher

Informa UK Limited

Subject

Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,Condensed Matter Physics

Link

https://www.tandfonline.com/doi/pdf/10.1080/00202967.2022.2107773

Reference21 articles.

1. BG patent № 40243/02.02: 1994.

2. USP № 4681591/21.07: 1987.

3. USP № 5871816/16.02: 1999.

4. An alternative method for selective metal deposition onto flexible materials

5. Effect of copper content on the properties of Ni–Cu–P plated polyester fabric

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1. Electrochemical characteristics of eco-friendly electroless copper nano film deposition using dithiocarbamate derivative;Materials Today: Proceedings;2023-07

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