Composite gallium soldering pastes for low-temperature diffusion soldering of cermet sections-Reference-Cited by-同舟云学术

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Composite gallium soldering pastes for low-temperature diffusion soldering of cermet sections

Published:2012-01 Issue:1 Volume:26 Page:51-53
ISSN:0950-7116
Container-title:Welding International
language:en
Short-container-title:Welding International

Author:

Temnykh V. I.,Kazakov V. S.,Mityaev A. E.,Temnykh E. V.

Publisher

Informa UK Limited

Subject

Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Link

http://www.tandfonline.com/doi/pdf/10.1080/09507116.2011.592714

Reference6 articles.

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Analysis of intermetallic compound formation in the reactions at liquid Ga/solid Pd interface;Surfaces and Interfaces;2022-06

2. Properties of CuGa2 Formed Between Liquid Ga and Cu Substrates at Room Temperature;Journal of Electronic Materials;2019-10-10

3. Formation of intermetallic compounds in the solid-liquid composites of the Ga-Ni system;Materials Research Express;2018-09-14

4. Ga-Based Alloys in Microelectronic Interconnects: A Review;Materials;2018-08-08

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