Liquid Explosive Evaporative Removal of Submicron Particles from Hydrophilic Oxidized Silicon Surfaces-Reference-Cited by-同舟云学术

Liquid Explosive Evaporative Removal of Submicron Particles from Hydrophilic Oxidized Silicon Surfaces

Published:1997-02 Issue:1-4 Volume:61 Page:293-307
ISSN:0021-8464
Container-title:The Journal of Adhesion
language:en
Short-container-title:The Journal of Adhesion

Author:

Boughaba S.,Wu X.,Sacher E.,Meunier M.

Publisher

Informa UK Limited

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry

Link

http://www.tandfonline.com/doi/pdf/10.1080/00218469708010527

Reference21 articles.

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3. Burkman, D. C., Deal, D., Grant, D. C. and Peterson, C. A. 1993.Handbook of Semiconductor Wafer Cleaning, Edited by: Kern, W. 111Park Ridge, N.J.: Noyes Publications.

4. Ruzyllo, J. 1993.Handbook of Semiconductor Wafer Cleaning, Edited by: Kern, W. 201Park Ridge, N. J.: Noyes Publications.

5. Laser‐assisted micron scale particle removal

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