ENHANCEMENT OF CONVECTIVE HEAT TRANSFER FROM SMALL HEAT SOURCES TO LIQUID COOLANTS USING STRIP FINS
Author:
Affiliation:
1. School of Mechanical Engineering, Purdue University, West Lafayette, Indiana, 47907
Publisher
Informa UK Limited
Subject
Electrical and Electronic Engineering,Instrumentation,Control and Systems Engineering
Link
https://www.tandfonline.com/doi/pdf/10.1080/08916158708946349
Reference13 articles.
1. Conduction Cooling for an LSI Package: A One-Dimensional Approach
2. A Conduction-Cooled Module for High-Performance LSI Devices
3. Liquid cooling of microelectronic devices by free and forced convection
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