The interfacial energy of coherent twin boundaries in copper-Reference-Cited by-同舟云学术

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The interfacial energy of coherent twin boundaries in copper

Published:1961-07 Issue:67 Volume:6 Page:937-938
ISSN:0031-8086
Container-title:Philosophical Magazine
language:en
Short-container-title:Philosophical Magazine

Author:

Inman M. C.,Khan A. R.

Publisher

Informa UK Limited

Link

http://www.tandfonline.com/doi/pdf/10.1080/14786436108243349

Reference4 articles.

1. Fisher, J. C. and Dunn, C. G. 1962.Imperfections in Nearly Perfect Crystals, 317New York: John Wiley & Sons.

2. Interfacial Free Energy of Coherent Twin Boundaries in Copper

3. Die aufspaltung von versetzungen in metallen dichtester kugelpackung

4. The effect of stacking fault energy on low temperature creep in pure metals

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3. Atomic scale volume and grain boundary diffusion elucidated by in situ STEM;Nature Communications;2023-11-22

4. Temperature dependence of the stacking-fault Gibbs energy for Al, Cu, and Ni;Physical Review B;2018-12-26

5. Enhancing the high temperature plasticity of a Cu-containing austenitic stainless steel through grain boundary strengthening;Materials Science and Engineering: A;2014-04

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