Analysis of mechanical properties of copper thin film in ambient, DI water and slurry environment by nanoindentation
Author:
Affiliation:
1. Department of Mechanical Engineering, National Taiwan University of Science and Technology, Taipei, Taiwan
Publisher
Informa UK Limited
Subject
Industrial and Manufacturing Engineering,Mechanics of Materials,General Materials Science
Link
https://www.tandfonline.com/doi/pdf/10.1080/2374068X.2021.1917979
Reference22 articles.
1. Chemical Mechanical Planarization from Macro-Scale to Molecular-Scale
2. Comparison between nanoindentation and scratch test hardness (scratch hardness) values of copper thin films on oxidised silicon substrates
3. Nanomechanical properties of copper thin films on different substrates using the nanoindentation technique
4. Nano-scratch evaluations of copper chemical mechanical polishing
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Characterization of Nanomechanical Properties and Scratch Hardness of (111) Nanotwinned Copper Thin Film in Ambient and Slurry Conditions;ECS Journal of Solid State Science and Technology;2022-06-01
2. Analytical Modelling of Material Removal in Copper Chemical Mechanical Polishing Incorporating the Scratch Hardness of the Passivated Layer on Copper Thin Film Wafer;ECS Journal of Solid State Science and Technology;2022-04-01
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