Evolution of triple junctions’ network during severe plastic deformation of copper alloys – a discrete stochastic modelling
Author:
Affiliation:
1. Mechanics and Physics of Solids Research Group, Department of MACE, The University of Manchester, Manchester, UK
Publisher
Informa UK Limited
Subject
Condensed Matter Physics
Link
https://www.tandfonline.com/doi/pdf/10.1080/14786435.2019.1695071
Reference28 articles.
1. Microtexture analysis of restoration mechanisms during high pressure torsion of pure nickel
2. Improved representations of misorientation information for grain boundary science and engineering
3. Grain boundary engineering based on fractal analysis for control of segregation-induced intergranular brittle fracture in polycrystalline nickel
4. Grain Refinement Kinetics in a Low Alloyed Cu–Cr–Zr Alloy Subjected to Large Strain Deformation
5. Dynamic and post-dynamic recrystallization under hot, cold and severe plastic deformation conditions
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