Effect of Ni content on the diffusion-controlled growth of the product phases in the Cu(Ni)–Sn system
Author:
Publisher
Informa UK Limited
Subject
Condensed Matter Physics
Link
http://www.tandfonline.com/doi/pdf/10.1080/14786435.2015.1119905
Reference27 articles.
1. Cu-Ni-Sn: A Key System for Lead-Free Soldering
2. Solid-State Reactions between Cu(Ni) Alloys and Sn
3. Formation of Intermetallic Compounds Between Liquid Sn and Various CuNi x Metallizations
4. Morphology and chemical composition of Cu/Sn/Cu and Cu(5 at-%Ni)/Sn/Cu(5 at-%Ni) interconnections
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