Author:
Lam Tung T.,Yeung Wing K.
Subject
Computer Science Applications,Mechanics of Materials,Condensed Matter Physics,Modeling and Simulation,Numerical Analysis
Reference10 articles.
1. SOLUTION OF TWO-DIMENSIONAL HYPERBOLIC HEAT CONDUCTION BY HIGH-RESOLUTION NUMERICAL METHODS
2. T. T. Lam and W. K. Yeung, Thermal Waves in the Substrate of Integrated Circuit Chips, in E. Suhir, M. Shiratori, Y. C. Lee, and G. Subbarayan (eds.), Advances in Electronic Packaging, ASME EEP-Vol. 19-2, pp. 2037-2044, 1997.
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