Effects of Curie particle induced accelerated curing on thermo mechanical performance of 2K structural adhesives – Part I: Bulk properties-Reference-Cited by-同舟云学术

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Effects of Curie particle induced accelerated curing on thermo mechanical performance of 2K structural adhesives – Part I: Bulk properties

Published:2021-05-03 Issue: Volume: Page:1-42
ISSN:0021-8464
Container-title:The Journal of Adhesion
language:en
Short-container-title:The Journal of Adhesion

Author:

Voß Morten¹^ORCID,Vallée Till¹^ORCID

Affiliation:

1. Department of Adhesive Bonding Technology, Fraunhofer Institute for Manufacturing Technology and Advanced Materials IFAM, Bremen, Germany

Funder

Allianz Industrie Forschung

Publisher

Informa UK Limited

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry

Link

https://www.tandfonline.com/doi/pdf/10.1080/00218464.2021.1909482

Reference53 articles.

1. Cure-on-command technology: A review of the current state of the art

2. Study on Microwave Curing of Polyurethane (PU)/Epoxy (EP) Interpenetrating Networks (IPN)

3. Wang, T.; Fu, Y.; Becker, M.; Liu, J. Microwave Cure of Metal-filled Electrically Conductive Adhesive. undefined 2001.

4. UV-Curing of Adhesives: A Critical Review

5. UV- and thermal-curing behaviors of dual-curable adhesives based on epoxy acrylate oligomers

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Low-temperature adhesive curing in timber engineering: About the relationship between curing kinetics and mechanical properties;International Journal of Adhesion and Adhesives;2024-09

2. Debonding-on-demand Fe₃O₄-epoxy adhesively bonded dissimilar joints via electromagnetic induction heating;The Journal of Adhesion;2023-09-13

3. Low-temperature curing of adhesives – Large-scale experiments;The Journal of Adhesion;2022-04-03

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