Enhancing adhesion of thermosetting urea-formaldehyde resins by preventing the formation of H-bonds with multi-reactive melamine-Reference-Cited by-同舟云学术

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Enhancing adhesion of thermosetting urea-formaldehyde resins by preventing the formation of H-bonds with multi-reactive melamine

Published:2020-10-15 Issue:3 Volume:98 Page:257-285
ISSN:0021-8464
Container-title:The Journal of Adhesion
language:en
Short-container-title:The Journal of Adhesion

Author:

Wibowo Eko Setio¹,Park Byung-Dae¹

Affiliation:

1. Department of Wood and Paper Science, Kyungpook National University, Daegu, Republic of Korea

Funder

National Research Foundation of Korea

Publisher

Informa UK Limited

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry

Link

https://www.tandfonline.com/doi/pdf/10.1080/00218464.2020.1830069

Reference55 articles.

1. Urea–formaldehyde (UF) adhesive resins for wood

2. Upgrading of MUF particleboard adhesives and decrease of melamine content by buffer and additives

3. Formaldehyde Release From Urea-Formaldehyde Bonded Wood Products

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