Developments in Microencapsulation Technology to Improve Adhesive Formulations-Reference-Cited by-同舟云学术

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Developments in Microencapsulation Technology to Improve Adhesive Formulations

Published:2012-04 Issue:4-6 Volume:88 Page:391-405
ISSN:0021-8464
Container-title:The Journal of Adhesion
language:en
Short-container-title:The Journal of Adhesion

Author:

Arán-Ais Francisca,Pérez-Limiñana María Ángeles,Sánchez-Navarro M. Magdalena,Orgilés-Barceló César

Publisher

Informa UK Limited

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry

Link

http://www.tandfonline.com/doi/pdf/10.1080/00218464.2012.660368

Reference33 articles.

1. Schleicher , L. B. and Green , K. , US Patent 2,730,456 (1956).

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Microcapsules of Poly(butylene adipate-co-terephthalate) (PBAT) Loaded with Aliphatic Isocyanates for Adhesive Applications;ACS Applied Polymer Materials;2024-05-02

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3. Optimization of a microfluidic process to encapsulate isocyanate for autoreactive and ecological adhesives;Polymer Bulletin;2021-04-16

4. Microfluidic-Assisted Fabrication of Monodisperse Core–Shell Microcapsules for Pressure-Sensitive Adhesive with Enhanced Performance;Nanomaterials;2020-02-06

5. Phase change materials for building construction: An overview of nano-/micro-encapsulation;Nanotechnology Reviews;2020-01-01

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