Analyzing Deformation of a Cationic Photopolymerized Epoxy Adhesive during the Curing Process in UV Irradiation and Dark Reaction based on Finite Element Method and Measurement-Reference-Cited by-同舟云学术

Analyzing Deformation of a Cationic Photopolymerized Epoxy Adhesive during the Curing Process in UV Irradiation and Dark Reaction based on Finite Element Method and Measurement

Published:2023-07-21 Issue: Volume: Page:1-17
ISSN:0021-8464
Container-title:The Journal of Adhesion
language:en
Short-container-title:The Journal of Adhesion

Author:

Takahashi A.¹²,Sekiguchi Y.³,Taki N.⁴,Okamura M.⁴,Sato C.³

Affiliation:

1. Laser and Photonics Research Department, Optical Technologies R&D Center, Fujikura Ltd, Chiba, Japan

2. Department of Mechanical Engineering, School of Engineering, Tokyo Institute of Technology, Yokohama, Japan

3. Institute of Innovative Research, Tokyo Institute of Technology, Yokohama, Japan

4. JSOL Corporation, Analysis Technology Department, Tokyo, Japan

Publisher

Informa UK Limited

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry

Link

https://www.tandfonline.com/doi/pdf/10.1080/00218464.2023.2238611

Reference33 articles.

1. A study on UV-curable adhesives for optical pick-up: I. Photo-initiator effects

2. High precision automated tab assembly with micro optics for optimized high-power diode laser collimation

3. Precision alignment for next generation semiconductor packaging

4. Analysis of nano-creep deformation of epoxy adhesive in optical fiber connector for long-term reliability prediction

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