Investigation of the thermal strain behaviour of bonded joints in a cryogenic environment-Reference-Cited by-同舟云学术

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Investigation of the thermal strain behaviour of bonded joints in a cryogenic environment

Published:2023-11-18 Issue: Volume: Page:1-15
ISSN:0021-8464
Container-title:The Journal of Adhesion
language:en
Short-container-title:The Journal of Adhesion

Author:

Seewald Robert¹^ORCID,Bayer Maximilian¹,Schiebahn Alexander¹,Reisgen Uwe¹

Affiliation:

1. Adhesive Bonding Department, ISF – Welding and Joining Institute, Rheinisch-Westfalische Technische Hochschule, Aachen, Germany

Publisher

Informa UK Limited

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry

Link

https://www.tandfonline.com/doi/pdf/10.1080/00218464.2023.2284964

Reference20 articles.

1. Matter and Methods at Low Temperatures

2. AMS-100: The next generation magnetic spectrometer in space – An international science platform for physics and astrophysics at Lagrange point 2

3. Organic polymer materials in the space environment

4. Kaiser, W. Kunststoffchemie für Ingenieure: Von der Synthese bis zur Anwendung 5. Auflage ; München: Hanser Verlag, 2021.

5. Mechanical behaviour of graphene oxide embedded epoxy nanocomposite at sub- and above- zero temperature environments

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