Machining of micro-holes on borosilicate glass using micro-electro chemical discharge machining (µ-ECDM) and parametric optimisation
Author:
Affiliation:
1. Department of Mechanical Engineering, Indian Institute of Technology Madras, Chennai, India
Publisher
Informa UK Limited
Subject
Industrial and Manufacturing Engineering,Mechanics of Materials,General Materials Science
Link
https://www.tandfonline.com/doi/pdf/10.1080/2374068X.2019.1636187
Reference23 articles.
1. Investigation on machining copper plates with NiP coated tools using tailor-made micro-electro discharge machine
2. Machinability and characterisation of machined hole on quartz using developed µ-AJM set-up
3. Micromachined glass apertures for artificial lipid bilayer formation in a microfluidic system
4. A review of micropumps
5. Silicon–glass-based single piezoresistive pressure sensors for harsh environment applications
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