Preparation and Evaluation of Epoxy Based Material for High Performance Electronic Packaging through the Surface Modification of Fillers
Author:
Affiliation:
1. China Bluestar Chengrand Chemical Co., Ltd, Chengdu, China
2. China Bluestar Chengrand Chemical Research and Design Institute Co., Ltd, Chengdu, China
Publisher
Informa UK Limited
Link
https://www.tandfonline.com/doi/pdf/10.1080/00222348.2024.2372970
Reference31 articles.
1. Structural studies of epoxy resin with impurities of carbon nanostructures
2. The application of epoxy resin polymers by laser induction technologies
3. Electronic Interaction of Epoxy Resin with Copper at the Adhered Interface
4. A review of high-quality epoxy resins for corrosion-resistant applications
5. Shrinkage stress of thermal cured epoxy resin reduced by addition of functional hollow microspheres
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