Thermal-activation parameters for asymmetric {211} slip in Li-Mg alloy crystals
Author:
Publisher
Informa UK Limited
Subject
Metals and Alloys,Physics and Astronomy (miscellaneous),Condensed Matter Physics,General Materials Science,Electronic, Optical and Magnetic Materials
Link
http://www.tandfonline.com/doi/pdf/10.1080/01418618208240911
Reference9 articles.
1. The calculation of shear stress and shear strain for double glide in tension and compression
2. The deformation behaviour of dilute niobium-nitrogen alloys
3. Christian, J. W. 1970. Proceedings of the Second International Conference on the Strength of Metals and Alloys. 1970. pp.31Metals Park, Ohio: American Society for Metals.
4. Consequences of asymmetric energy barriers to dislocation motion
5. Mora-Vargas, M. I., Saka, H. and Taylor, G. 1979. Proceedings of the Fifth International Conference on the Strength of Metals and Alloys. 1979. pp.1007Oxford: Pergamon Press.
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