Kinematic and isotropic strain hardening in copper with highly aligned nanoscale twins-Reference-Cited by-同舟云学术

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Kinematic and isotropic strain hardening in copper with highly aligned nanoscale twins

Published:2018-03-27 Issue:6 Volume:6 Page:333-338
ISSN:2166-3831
Container-title:Materials Research Letters
language:en
Short-container-title:Materials Research Letters

Author:

Wang Hao¹,You Zesheng¹^ORCID,Lu Lei²

Affiliation:

1. Herbert Gleiter Institute of Nanoscience, Nanjing University of Science and Technology, Nanjing, People’s Republic of China

2. Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang, People’s Republic of China

Funder

National Key R&D Program of China

National Natural Science Foundation of China

Key Research Program of Frontier Sciences, Chinese Academy of Sciences

Fundamental Research Funds for the Central Universities

Natural Science Foundation of Jiangsu Province

Publisher

Informa UK Limited

Subject

General Materials Science

Link

https://www.tandfonline.com/doi/pdf/10.1080/21663831.2018.1455752

Reference38 articles.

1. Stabilizing nanostructures in metals using grain and twin boundary architectures

2. Ultrahigh Strength and High Electrical Conductivity in Copper

3. Strengthening Materials by Engineering Coherent Internal Boundaries at the Nanoscale

4. Growth Twins and Deformation Twins in Metals

5. Observation of Atomic Diffusion at Twin-Modified Grain Boundaries in Copper

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