Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry
Cited by
13 articles.
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1. Copper and Copper Alloys;Surface Preparation Techniques for Adhesive Bonding;2013
2. Growth of electrolytic copper dendrites and their adhesion to an epoxy resin;Surface and Coatings Technology;1998-07
3. Mold Compound Adhesion and Strength;Characterization of Integrated Circuit Packaging Materials;1993
4. The role of plastic package adhesion in performance;IEEE Transactions on Components, Hybrids, and Manufacturing Technology;1991
5. Chemical and electrochemical oxidation of copper in dielectric millimeter waveguide tubes;Journal of Applied Electrochemistry;1983-03