Intelligent process design system for the transfer moulding of electronic packages
Author:
Affiliation:
1. a Department of Industrial and Systems Engineering , The Hong Kong Polytechnic University , Hung Hom, Kowloon, Hong Kong
Publisher
Informa UK Limited
Subject
Industrial and Manufacturing Engineering,Management Science and Operations Research,Strategy and Management
Link
https://www.tandfonline.com/doi/pdf/10.1080/00207540310001652860
Reference21 articles.
1. Cheung KH 1998 Process modelling, and optimisation, using neural networks MSc dissertation, Hong Kong Polytechnic University
2. C-MOLD 2000 AC Technology Co
3. Egan E Kelly G O'Donovan T Murtagh D Herard L 2000 Response surface methodology for matrix PBGA warpage prediction InSeventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systemspp. 377–384
4. Training feedforward networks with the Marquardt algorithm
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