Automated bonding position inspection on multi-layered wire IC using machine vision
Author:
Affiliation:
1. a Department of Industrial Engineering and Management , National Chiao-Tung University , Hsinchu, Taiwan, ROC
Publisher
Informa UK Limited
Subject
Industrial and Manufacturing Engineering,Management Science and Operations Research,Strategy and Management
Link
https://www.tandfonline.com/doi/pdf/10.1080/00207540903059497
Reference20 articles.
1. INSPAD: a system for automatic bond pad inspection
2. A vision system for inspection of ball bonds in integrated circuits
3. A vision system for inspection of ball bonds and 2-D profile of bonding wires in integrated circuits
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