ANALYTICAL MODELING AND ANALYSIS OF THROUGH SILICON VIAS (TSVS) IN HIGH SPEED THREE-DIMENSIONAL SYSTEM INTEGRATION
Author:
Publisher
The Electromagnetics Academy
Subject
Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Link
http://www.jpier.org/download/15021404.pdf
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. AM3D: An accurate crosstalk probability modeling to predict channel delay in 3D ICs;Microelectronics Reliability;2019-11
2. Notice of Retraction: Defects Identification in a TSV Daisy-Chain Structure by a Machine Learning Approach;IEEE Transactions on Electromagnetic Compatibility;2018-12
3. Novel De-Embedding Methodology and Broadband Microprobe Measurement for Through-Silicon Via Pair in Silicon Interposer;IEEE Transactions on Electromagnetic Compatibility;2017-10
4. Three Dimensional Integration Technology Applied to Neuromorphic Hardware Implementation;2015 IEEE International Symposium on Nanoelectronic and Information Systems;2015-12
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