Assessing stability of metal tellurides as alternative photomask materials for extreme ultraviolet lithography

Author:

Luong Vu1ORCID,Philipsen Vicky1,Opsomer Karl1,Rip Jens1,Hendrickx Eric1,Heyns Marc1,Detavernier Christophe2,Laubis Christian3,Scholze Frank3

Affiliation:

1. IMEC, Kapeldreef 75, B-3001 Leuven, Belgium

2. COCOON, Department of Solid State Sciences, Universiteit Gent, Zwijnaardsesteenweg 294, B-9000 Gent, Belgium

3. Physikalisch-Technische Bundesanstalt (PTB), Abbestraße 2-12, 10587 Berlin, Germany

Funder

ECSEL JU

Publisher

American Vacuum Society

Subject

Materials Chemistry,Electrical and Electronic Engineering,Surfaces, Coatings and Films,Process Chemistry and Technology,Instrumentation,Electronic, Optical and Magnetic Materials

Cited by 14 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Best focus alignment through pitch strategies for hyper-NA EUV lithography;Optical and EUV Nanolithography XXXVII;2024-04-10

2. Nonsymmorphic symmetry protected nodal lines in layered topological semimetal Ta3GeTe6;Applied Physics Letters;2024-04-08

3. Identifying new absorber materials for EUV photomasks;Photomask Technology 2023;2023-11-21

4. Exploring photomask etching capabilities for new extreme ultraviolet absorber materials;Photomask Japan 2023: XXIX Symposium on Photomask and Next-Generation Lithography Mask Technology;2023-09-29

5. Evaluation of Ta-Co alloys as novel high-k extreme ultraviolet mask absorber;Journal of Micro/Nanopatterning, Materials, and Metrology;2023-06-21

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