Effect of the substrate bias voltage on the physical characteristics of copper films deposited by microwave plasma-assisted sputtering technique-Reference-Cited by-同舟云学术

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Effect of the substrate bias voltage on the physical characteristics of copper films deposited by microwave plasma-assisted sputtering technique

Published:2004-01 Issue:1 Volume:22 Page:30-35
ISSN:0734-2101
Container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
language:en
Short-container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films

Author:

Thièry F.,Pauleau Y.,Ortega L.

Publisher

American Vacuum Society

Subject

Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics

Link

http://avs.scitation.org/doi/pdf/10.1116/1.1626643

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1. Effect of substrate bias on the formation of nanotwin and properties in Cu thin films for advanced packaging technology;Surface and Coatings Technology;2024-04

2. Optimized optical/electrical/mechanical properties of ultrathin metal films for flexible transparent conductor applications: review [Invited];Optical Materials Express;2023-01-03

3. Effect of ion control strategies on the deposition rate and properties of copper films in bipolar pulse high power impulse magnetron sputtering;Journal of Materials Science;2022-12-13

4. Suppressing channel-shortening effect of self-aligned coplanar Al-doped In-Sn-Zn-O TFTs using Mo-Al alloy source/drain electrode as Cu diffusion barrier;Journal of Alloys and Compounds;2021-04

5. Microwave Plasma;RF Power Semiconductor Generator Application in Heating and Energy Utilization;2020

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