Ni full-filling into Al2O3/Al film with etched tunnels using a polyethylene glycol solution bath in electroless-plating-Reference-Cited by-同舟云学术

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Ni full-filling into Al2O3/Al film with etched tunnels using a polyethylene glycol solution bath in electroless-plating

Published:2010-11 Issue:6 Volume:28 Page:1231-1234
ISSN:2166-2746
Container-title:Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena
language:en
Short-container-title:Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena

Author:

Jang Joo-Hee,Lee Chang-Hyoung,Choi Woo-Sung,Kim Nam-Jeong,Kim Taek-You,Kim Tae-Yoo,Kim Jang-Hyun,Park Chan,Suh Su-Jeong

Publisher

American Vacuum Society

Subject

Materials Chemistry,Electrical and Electronic Engineering,Surfaces, Coatings and Films,Process Chemistry and Technology,Instrumentation,Electronic, Optical and Magnetic Materials

Link

http://avs.scitation.org/doi/pdf/10.1116/1.3506105

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Fabrication and Characteristics of High Capacitance Al Thin Films Capacitor Using a Polymer Inhibitor Bath in Electroless Plating Process;Journal of Nanoscience and Nanotechnology;2015-10-01

2. Effects of Processing Temperatures of Nickel Plating on Capacitance Density of Alumina Film Capacitor;Journal of Nanoscience and Nanotechnology;2015-06-01

3. Effect of Microstructure on Electrical Properties of Thin Film Alumina Capacitor with Metal Electrode;Korean Journal of Materials Research;2011-06-27

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