Atomic layer deposition of high-quality Pt thin film as an alternative interconnect replacing Cu
Author:
Affiliation:
1. School of Materials Science and Engineering, Yeungnam University, 214-1, Dae-dong, Gyeongsan-City 712-749, South Korea
2. Tanaka Precious Metals, 22, Wadai, Tsukuba Ibaraki 300-4247, Japan
Funder
Ministry of Trade, Industry and Energy
Publisher
American Vacuum Society
Subject
Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics
Link
http://avs.scitation.org/doi/pdf/10.1116/1.5134696
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Growth behavior and mechanism of atomic layer deposition of Ru for replacing Cu-interconnects;Vacuum;2024-03
2. Dimension Control of Platinum Nanostructures by Atomic Layer Deposition: From Surface Chemical Reactions to Applications;Chemistry of Materials;2023-03-14
3. Growth mechanism and electrical properties of tungsten films deposited by plasma-enhanced atomic layer deposition with chloride and metal organic precursors;Applied Surface Science;2021-12
4. Ultralow Loading (Single‐Atom and Clusters) of the Pt Catalyst by Atomic Layer Deposition Using Dimethyl ((3,4‐η) N , N ‐dimethyl‐3‐butene‐1‐amine‐ N ) Platinum (DDAP) on the High‐Surface‐Area Substrate for Hydrogen Evolution Reaction;Advanced Materials Interfaces;2020-12-15
5. Atomic Layer Deposition of Indium‐Tin‐Oxide as Multifunctional Coatings on V 2 O 5 Thin‐Film Model Electrode for Lithium‐Ion Batteries;Advanced Materials Interfaces;2020-10-13
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