Highly preferred (111) texture aluminum-copper films formed with argon plasma treatment of the titanium underlayer and their electromigration endurance as interconnects
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Published:1997-07
Issue:4
Volume:15
Page:961
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ISSN:0734-211X
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Container-title:Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
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language:
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Short-container-title:J. Vac. Sci. Technol. B
Author:
Kamoshida Kazuyoshi
Publisher
American Vacuum Society
Subject
General Engineering
Cited by
18 articles.
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