Improving the thermal stability of nickel monosilicide thin films by combining annealing with the use of an interlayer and a capping layer
Author:
Publisher
American Vacuum Society
Subject
Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics
Link
http://avs.scitation.org/doi/pdf/10.1116/1.3565468
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Rapid fabrication and interface structure of highly faceted epitaxial Ni-Au solid solution nanoparticles on sapphire;Acta Materialia;2021-11
2. Texture evolution and microstructural changes during solid-state dewetting: A correlative study by complementary in situ TEM techniques;Acta Materialia;2016-08
3. Improvement of the thermal stability of nickel silicide using a ruthenium interlayer deposited via remote plasma atomic layer deposition;Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films;2016-05
4. Characterization of ultra-thin nickel–silicide films synthesized using the solid state reaction of Ni with an underlying Si:P substrate (P: 0.7 to 4.0%);Microelectronic Engineering;2016-05
5. The process of solid-state dewetting of Au thin films studied by in situ scanning transmission electron microscopy;Acta Materialia;2015-05
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