New taper-etching technology using oxygen ion plasma
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Published:1990-05
Issue:3
Volume:8
Page:529
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ISSN:0734-211X
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Container-title:Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
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language:
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Short-container-title:J. Vac. Sci. Technol. B
Author:
Hashimoto Chisato
Publisher
American Vacuum Society
Subject
General Engineering
Cited by
3 articles.
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1. Methods/Principles of Deposition and Etching of Thin Films;Handbook of Semiconductor Interconnection Technology, Second Edition;2006-02-22
2. Characterization of electron cyclotron resonance process plasma and film deposition;Materials Science and Engineering: A;1991-07
3. Electron cyclotron resonance microwave ion sources for thin film processing;Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms;1991-05