Plasma jet based in situ reduction of copper oxide in direct write printing-Reference-Cited by-同舟云学术

Plasma jet based in situ reduction of copper oxide in direct write printing

Published:2019-05 Issue:3 Volume:37 Page:031203
ISSN:2166-2746
Container-title:Journal of Vacuum Science & Technology B
language:en
Short-container-title:Journal of Vacuum Science & Technology B

Author:

Dey Avishek¹²,Lopez Arlene¹,Filipič Gregor¹,Jayan Aditya¹,Nordlund Dennis³,Koehne Jessica¹,Krishnamurthy Satheesh²,Gandhiraman Ram P.¹,Meyyappan M.¹

Affiliation:

1. NASA Ames Research Center, Moffett Field, California 94035

2. School of Engineering and Innovation, The Open University, Milton Keynes, United Kingdom

3. SLAC National Accelerator Laboratory, Menlo Park, California 94025

Publisher

American Vacuum Society

Subject

Materials Chemistry,Electrical and Electronic Engineering,Surfaces, Coatings and Films,Process Chemistry and Technology,Instrumentation,Electronic, Optical and Magnetic Materials

Link

http://avs.scitation.org/doi/pdf/10.1116/1.5087255

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