Flexible substrate and release layer for flexible MEMS devices-Reference-Cited by-同舟云学术

Flexible substrate and release layer for flexible MEMS devices

Published:2013-09 Issue:5 Volume:31 Page:050602
ISSN:2166-2746
Container-title:Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena
language:en
Short-container-title:Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena

Author:

Ahmed Moinuddin,Butler Donald P.

Publisher

American Vacuum Society

Subject

Materials Chemistry,Electrical and Electronic Engineering,Surfaces, Coatings and Films,Process Chemistry and Technology,Instrumentation,Electronic, Optical and Magnetic Materials

Link

http://avs.scitation.org/doi/pdf/10.1116/1.4816938

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4. Neural microprobe modelling and microfabrication for improved implantation and mechanical failure mitigation;Philosophical Transactions of the Royal Society A: Mathematical, Physical and Engineering Sciences;2022-06-06

5. Large-area photonic lift-off process for flexible thin-film transistors;npj Flexible Electronics;2022-02-28