Shape tuning of large area silicon nanotip arrays through reactive ion etching

Author:

Sankabathula Giridhar Tulasi Ram1,Valluri Srujana1ORCID,Norden Nick1,Binderup Stephen1ORCID,Sumant Anirudha2ORCID,Divan Ralu2ORCID,Mohsen Osama3,Piot Philippe3ORCID,Korampally Venumadhav1ORCID

Affiliation:

1. Department of Electrical Engineering, Northern Illinois University 1 , Dekalb, Illinois 60115

2. Center for Nanoscale Materials, Argonne National Laboratory 2 , Argonne, Illinois 60439

3. Department of Physics, Northern Illinois University 3 , Dekalb, Illinois 60115

Abstract

Nanostructures formed in silicon form an important class of structures that span a broad spectrum of application areas. Of these, columnar structures of silicon featuring tiplike apexes have their own niche applications. The ability to afford shape tunability for these structures further enhances their application potential. In this paper, we present our findings on the large area fabrication of silicon nanotips defined through microsphere lithography and shape tuned through a combination of different reactive ion etching (RIE) techniques. The self-sharpening mechanism of the tips when using nonplanar etch masks (microspheres) under anisotropic etching conditions is elucidated. We further show that depending on the manner of etching (continuous versus discrete multistep etch), identical anisotropic etching recipes produce vastly different tip morphologies. Hourglass-shaped silicon tips were obtained when silicon was subjected to anisotropic followed by isotropic etching conditions. Sharp silicon tips with tip apex radii on the order of 2 nm have been successfully realized when the RIE shape tuned tips were subjected to a series of oxidative sharpening steps.

Funder

U.S. Department of Energy

National Science Foundation

Publisher

American Vacuum Society

Subject

Materials Chemistry,Electrical and Electronic Engineering,Surfaces, Coatings and Films,Process Chemistry and Technology,Instrumentation,Electronic, Optical and Magnetic Materials

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