Author:
Shoaf S. E.,Feinerman A. D.
Subject
Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics
Cited by
11 articles.
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1. Packaging;Silicon Carbide Microsystems for Harsh Environments;2011
2. Fusion-bonded fluidic interconnects;Journal of Micromechanics and Microengineering;2008-04-01
3. Wafer Bonding Techniques for MEMS;Sensor Letters;2005-12-01
4. Synthesis of Cell Structures;Nanoscale Technology in Biological Systems;2004-12-20
5. Nano-film assisted anodic bonding;Nano- and Microtechnology: Materials, Processes, Packaging, and Systems;2002-11-01