Characterization and optimization of bonding and interconnect technology for 3D stacking thin dies-Reference-Cited by-同舟云学术

Characterization and optimization of bonding and interconnect technology for 3D stacking thin dies

Published:2021-09 Issue:5 Volume:39 Page:052207
ISSN:2166-2746
Container-title:Journal of Vacuum Science & Technology B
language:en
Short-container-title:Journal of Vacuum Science & Technology B

Author:

Nittala Pavani Vamsi Krishna¹^ORCID,Haridas Karthika¹,Nigam Shivam¹,Tasneem Saba¹,Sen Prosenjit¹

Affiliation:

1. Centre for Nano Science and Engineering, Indian Institute of Science, Bengaluru, KA 560012, India

Funder

Ministry of Electronics and Information technology

office of the Principal Scientific Adviser to the Government of India

Publisher

American Vacuum Society

Subject

Materials Chemistry,Electrical and Electronic Engineering,Surfaces, Coatings and Films,Process Chemistry and Technology,Instrumentation,Electronic, Optical and Magnetic Materials

Link

https://avs.scitation.org/doi/pdf/10.1116/6.0001160

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