First-wafer effect in remote plasma processing: The stripping of photoresist, silicon nitride, and polysilicon-Reference-Cited by-同舟云学术

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First-wafer effect in remote plasma processing: The stripping of photoresist, silicon nitride, and polysilicon

Published:1994-07 Issue:4 Volume:12 Page:2810
ISSN:0734-211X
Container-title:Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
language:
Short-container-title:J. Vac. Sci. Technol. B

Author:

Loewenstein Lee M.

Publisher

American Vacuum Society

Subject

General Engineering

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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3. Process Equipment;Introduction to Microfabrication;2010-11-09

4. Chamber maintenance and fault detection technique for a gate etch process via self-excited electron resonance spectroscopy;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;2005

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