Experimental reliability study of cumulative damage models on state-of-the-art semiconductor technologies for step-stress tests and mission profile stresses-Reference-Cited by-同舟云学术

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Experimental reliability study of cumulative damage models on state-of-the-art semiconductor technologies for step-stress tests and mission profile stresses

Published:2020-11 Issue:6 Volume:38 Page:064001
ISSN:2166-2746
Container-title:Journal of Vacuum Science & Technology B
language:en
Short-container-title:Journal of Vacuum Science & Technology B

Author:

Hirler A.¹^ORCID,Biba J.¹,Lipp D.²,Lochner H.³,Siddabathula M.²,Simon S.³,Sulima T.¹,Wiatr M.²,Hansch W.¹

Affiliation:

1. Institute of Physics, Universität der Bundeswehr München, Werner-Heisenberg-Weg 39, 85577 Neubiberg, Germany

2. GLOBALFOUNDRIES Dresden Module Two LLC, Wilschdorfer Landstraße 101, 01109 Dresden, Germany

3. AUDI AG, Auto-Union-Straße 1, 85045 Ingolstadt, Germany

Funder

Bundesministerium für Bildung und Forschung

Publisher

American Vacuum Society

Subject

Materials Chemistry,Electrical and Electronic Engineering,Surfaces, Coatings and Films,Process Chemistry and Technology,Instrumentation,Electronic, Optical and Magnetic Materials

Link

http://avs.scitation.org/doi/pdf/10.1116/6.0000504

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Reliability forecasting and Accelerated Lifetime Testing in advanced CMOS technologies;Microelectronics Reliability;2023-12

2. Mission Profile Clustering Using a Universal Quantile Criterion;2022 IEEE International Reliability Physics Symposium (IRPS);2022-03

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