Author:
Crnogorac F.,Wong S.,Pease R. F. W.
Subject
Materials Chemistry,Electrical and Electronic Engineering,Surfaces, Coatings and Films,Process Chemistry and Technology,Instrumentation,Electronic, Optical and Magnetic Materials
Cited by
4 articles.
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1. Monolithic 3-D FPGAs;Proceedings of the IEEE;2015-07
2. Low-Temperature Monolithic Three-Layer 3-D Process for FPGA;IEEE Electron Device Letters;2013-08
3. Low-temperature Al–Ge bonding for 3D integration;Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena;2012-11
4. Low temperature nanointegration for emerging biomedical applications;Microelectronics Reliability;2012-02