Spin-on Cu films for ultralarge scale integrated metallization-Reference-Cited by-同舟云学术

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Spin-on Cu films for ultralarge scale integrated metallization

Published:1999 Issue:5 Volume:17 Page:2321
ISSN:0734-211X
Container-title:Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
language:en
Short-container-title:J. Vac. Sci. Technol. B

Author:

Murakami Hirohiko,Hirakawa Masaaki,Ohtsuka Yoshiro,Yamakawa Hiroyuki,Imazeki Nobuya,Hayashi Shigeo,Suzuki Toshihiro,Oda Masaaki,Hayashi Chikara

Publisher

American Vacuum Society

Subject

General Engineering

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effects of NH₃ Plasma Pre-Treatment of Ta Substrate on Atomic Layer Deposition of Cu Thin Film;Journal of Nanoscience and Nanotechnology;2012-04-01

2. Trench gap-filling copper by ion beam sputter deposition;Materials Chemistry and Physics;2006-05

3. Methods/Principles of Deposition and Etching of Thin Films;Handbook of Semiconductor Interconnection Technology, Second Edition;2006-02-22

4. Soft Magnetic Property and High-Electrical-Resistivity in Dense Fe Cluster Assemblies;Journal of the Japan Society of Powder and Powder Metallurgy;2005

5. Preparation and characterization of molybdenum and tungsten nitride nanoparticles obtained by thermolysis of molecular precursors;Journal of Materials Chemistry;2004

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