Magnetron co-sputtered μm-thick Mo–Cu films as structural material with low heat extension for key parts of high-power millimeter-band vacuum microelectronic devices-Reference-Cited by-同舟云学术

Magnetron co-sputtered μm-thick Mo–Cu films as structural material with low heat extension for key parts of high-power millimeter-band vacuum microelectronic devices

Published:2022-01 Issue:1 Volume:40 Page:014201
ISSN:2166-2746
Container-title:Journal of Vacuum Science & Technology B
language:en
Short-container-title:Journal of Vacuum Science & Technology B

Author:

Starodubov Andrey V.¹²^ORCID,Serdobintsev Alexey A.²^ORCID,Galushka Viktor V.¹²^ORCID,Kozhevnikov Ilya O.¹^ORCID,Pavlov Anton M.²^ORCID,Ulisse Giacomo³^ORCID,Krozer Viktor³^ORCID,Ryskin Nikita M.¹²^ORCID

Affiliation:

1. Saratov Branch, Kotelnikov Institute of Radio Engineering and Electronics RAS, 38 Zelenaya St., Saratov 410012, Russia

2. Saratov State University, 83 Astrakhanskaya St., Saratov 410004, Russia

3. Goethe University Frankfurt Am Main, Physics Institute, 1 Max-von-Lauestr Str., Frankfurt Am Main 60438, Germany

Funder

Russian Foundation for Basic Research

Deutsche Forschungsgemeinschaft

Publisher

American Vacuum Society

Subject

Materials Chemistry,Electrical and Electronic Engineering,Surfaces, Coatings and Films,Process Chemistry and Technology,Instrumentation,Electronic, Optical and Magnetic Materials

Link

https://avs.scitation.org/doi/pdf/10.1116/6.0001552

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