Author:
Kropewnicki Tom,Doan Kenny,Tang Betty,Björkman Claes
Subject
Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics
Cited by
9 articles.
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1. Low-k SiCxNyFilms Prepared by Plasma-Enhanced Chemical Vapor Deposition Using 1,3,5-trimethyl-1,3,5-trivinylcyclotrisilazane Precursor;Journal of The Electrochemical Society;2012
2. Single mask dual damascene processes;Microelectronic Engineering;2008-03
3. Plasma Etch;Handbook of Semiconductor Manufacturing Technology, Second Edition;2007-07-09
4. Chip Integration;Handbook of Semiconductor Interconnection Technology, Second Edition;2006-02-22
5. Modeling dual inlaid feature construction;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;2006