Ex situ tunnel junction process technique characterized by Coulomb blockade thermometry-Reference-Cited by-同舟云学术

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Ex situ tunnel junction process technique characterized by Coulomb blockade thermometry

Published:2010-09 Issue:5 Volume:28 Page:1026-1029
ISSN:2166-2746
Container-title:Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena
language:en
Short-container-title:Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena

Author:

Prunnila M.,Meschke M.,Gunnarsson D.,Enouz-Vedrenne S.,Kivioja J. M.,Pekola J. P.

Publisher

American Vacuum Society

Subject

Materials Chemistry,Electrical and Electronic Engineering,Surfaces, Coatings and Films,Process Chemistry and Technology,Instrumentation,Electronic, Optical and Magnetic Materials

Link

http://avs.scitation.org/doi/pdf/10.1116/1.3490406

Cited by 20 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermal Transport in Nanoelectronic Devices Cooled by On-Chip Magnetic Refrigeration;Physical Review Letters;2023-08-17

2. Microkelvin electronics on a pulse-tube cryostat with a gate Coulomb-blockade thermometer;Physical Review Research;2022-09-19

3. Coulomb Blockade Thermometry Beyond the Universal Regime;Journal of Low Temperature Physics;2021-06-28

4. 500 microkelvin nanoelectronics;Nature Communications;2020-03-20

5. On-Chip Demagnetisation Cooling of a High Capacitance CBT;Cooling Electrons in Nanoelectronic Devices by On-Chip Demagnetisation;2020

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