Chemical vapor deposited TiCN: A new barrier metallization for submicron via and contact applications-Reference-Cited by-同舟云学术

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Chemical vapor deposited TiCN: A new barrier metallization for submicron via and contact applications

Published:1995-05 Issue:3 Volume:13 Page:590-595
ISSN:0734-2101
Container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
language:en
Short-container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films

Author:

Eizenberg M.,Littau K.,Ghanayem S.,Liao M.,Mosely R.,Sinha A. K.

Publisher

American Vacuum Society

Subject

Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics

Link

http://avs.scitation.org/doi/pdf/10.1116/1.579791

Cited by 70 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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3. Semiconducting TiO2−xSx thin films by atomic layer deposition of TiS2 and its oxidation in ambient;Journal of Vacuum Science & Technology A;2019-03

4. Solar selective performance of metal nitride/oxynitride based magnetron sputtered thin film coatings: a comprehensive review;Journal of Optics;2018-02-13

5. Tribological Coatings for Biomedical Devices;Medical Coatings and Deposition Technologies;2016-08-08

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