Coefficient of thermal expansion and biaxial Young's modulus in Si-rich silicon nitride thin films-Reference-Cited by-同舟云学术

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Coefficient of thermal expansion and biaxial Young's modulus in Si-rich silicon nitride thin films

Published:2018-03 Issue:2 Volume:36 Page:021517
ISSN:0734-2101
Container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
language:en
Short-container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films

Author:

Habermehl Scott¹

Affiliation:

1. Sandia National Laboratories, P. O Box 5800, MS1084, Albuquerque, New Mexico 87185

Funder

U.S. Department of Energy

Publisher

American Vacuum Society

Subject

Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics

Link

http://avs.scitation.org/doi/am-pdf/10.1116/1.5020432

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