High-Q micromachined three-dimensional integrated inductors for high-frequency applications-Reference-Cited by-同舟云学术

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High-Q micromachined three-dimensional integrated inductors for high-frequency applications

Published:2007 Issue:1 Volume:25 Page:264
ISSN:1071-1023
Container-title:Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
language:en
Short-container-title:J. Vac. Sci. Technol. B

Author:

Weon Dae-Hee,Jeon Jong-Hyeok,Mohammadi Saeed

Publisher

American Vacuum Society

Subject

Electrical and Electronic Engineering,Condensed Matter Physics

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Molecular Dynamics Study on Mechanical Stress Formation during Polycrystalline Cr-Film Growth;Journal of Surface Investigation: X-ray, Synchrotron and Neutron Techniques;2022-12

2. Intrinsic stress-induced bending as a platform technology for controlled self-assembly of high-Q on-chip RF inductors;Journal of Micromechanics and Microengineering;2019-05-03

3. Diffusion Enhanced Drive Sub 100 °C Wafer Level Fine-Pitch Cu-Cu Thermocompression Bonding for 3D IC Integration;2019 IEEE 69th Electronic Components and Technology Conference (ECTC);2019-05

4. RF MEMS Inductors and Their Applications—A Review;Journal of Microelectromechanical Systems;2017-02

5. A resonant circuit realization using a 3D inductor in combination with thin film varactor technology;SPIE Proceedings;2015-11-06

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