Mechanical analysis of a flexible microelectronic system under twisting stress-Reference-Cited by-同舟云学术

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Mechanical analysis of a flexible microelectronic system under twisting stress

Published:2020-11 Issue:6 Volume:38 Page:063207
ISSN:2166-2746
Container-title:Journal of Vacuum Science & Technology B
language:en
Short-container-title:Journal of Vacuum Science & Technology B

Author:

Kim Cha-Hee¹^ORCID,Kim Jae-Min¹,Seo Seung-Ho²^ORCID,Lee Jae-Hak³,Song Jun-Yeob³,Lee Won-Jun¹^ORCID

Affiliation:

1. Department of Nanotechnology and Advanced Materials Engineering, Sejong University, 209 Neungdong-ro, Gwangjin-gu, Seoul 05006, Republic of Korea

2. R&D Team, GO Element Co. Ltd., 30, Geumseok 3-gil, Anseong-si, Gyeonggi-do 17539, Republic of Korea

3. Advanced Manufacturing System Research Division, Korea Institute of Machinery & Materials, 156, Gajeongbuk-ro, Yuseong-gu, Daejeon 34103, Republic of Korea

Funder

Ministry of Trade, Industry and Energy

Publisher

American Vacuum Society

Subject

Materials Chemistry,Electrical and Electronic Engineering,Surfaces, Coatings and Films,Process Chemistry and Technology,Instrumentation,Electronic, Optical and Magnetic Materials

Link

http://avs.scitation.org/doi/pdf/10.1116/6.0000665

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Finite Element Analysis for Safe Design of a Flexible Microelectronic System under Bending Deformation;ECS Journal of Solid State Science and Technology;2022-04-01

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