Excimer laser planarization of copper deposited over polyimide-Reference-Cited by-同舟云学术

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Excimer laser planarization of copper deposited over polyimide

Published:1990-09 Issue:5 Volume:8 Page:1097
ISSN:0734-211X
Container-title:Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
language:
Short-container-title:J. Vac. Sci. Technol. B

Author:

Baseman Robert J.

Publisher

American Vacuum Society

Subject

General Engineering

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Microroughness Reduction of Tungsten Films by Laser Polishing Technology with a Line Beam;Japanese Journal of Applied Physics;2004-04-09

2. Effects of excimer-laser irradiation of LaAlO 3 (100) single crystals: Influence on superconducting YBa 2 Cu 3 O 7-x film growth;Applied Physics A: Materials Science & Processing;1997-10-01

3. Electrochemical Planarization for Multilevel Metallization;Journal of The Electrochemical Society;1994-09-01

4. Copper deposition by electron cyclotron resonance plasma;Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films;1993-11

5. Pulsed Laser Planarization of Metals for IC Interconnect;MRS Proceedings;1991

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