Etch stop in via-hole etching on aluminum interconnection using inductively coupled C[sub 2]F[sub 6] plasma with O[sub 2] additive gas
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Published:2009
Issue:5
Volume:27
Page:2252
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ISSN:1071-1023
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Container-title:Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
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language:en
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Short-container-title:J. Vac. Sci. Technol. B
Author:
Imai Shin-ichi,Jiwari Nobuhiro
Publisher
American Vacuum Society
Subject
Electrical and Electronic Engineering,Condensed Matter Physics