Fabrication of sub-50-nm gate length n-metal–oxide–semiconductor field effect transistors and their electrical characteristics

Author:

Ono Mizuki

Publisher

American Vacuum Society

Subject

General Engineering

Cited by 28 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Capped carbon hard mask and trimming process: A low-cost and efficient route to nanoscale devices;Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena;2013-03

2. Minimizing poly end cap pull back by application of DFM and advanced etch approaches for 65nm and 45 nm technologies;SPIE Proceedings;2007-03-16

3. Integrated process of photoresist trimming and dielectric hard mask etching for sub-50 nm gate patterning;Thin Solid Films;2006-05

4. CHALLENGES FOR FUTURE SEMICONDUCTOR MANUFACTURING;International Journal of High Speed Electronics and Systems;2006-03

5. Sub-100 nm MOSFET fabrication with low temperature resist trimming process;Thin Solid Films;2004-09

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