Atomic layer deposition of silicon-based dielectrics for semiconductor manufacturing: Current status and future outlook-Reference-Cited by-同舟云学术

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Atomic layer deposition of silicon-based dielectrics for semiconductor manufacturing: Current status and future outlook

Published:2019-12 Issue:6 Volume:37 Page:060904
ISSN:0734-2101
Container-title:Journal of Vacuum Science & Technology A
language:en
Short-container-title:Journal of Vacuum Science & Technology A

Author:

Ovanesyan Rafaiel A.¹,Filatova Ekaterina A.²,Elliott Simon D.³,Hausmann Dennis M.⁴,Smith David C.⁴,Agarwal Sumit¹

Affiliation:

1. Department of Chemical and Biological Engineering, Colorado School of Mines, Golden, Colorado 80401

2. Tyndall National Institute, University College Cork, Cork T12 R5CP, Ireland

3. Schrödinger Inc., 120 West 45th Street, New York, New York 10036

4. Lam Research Corporation, Tualatin, Oregon 97062

Funder

Lam Research Corporation

Publisher

American Vacuum Society

Subject

Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics

Link

http://avs.scitation.org/doi/pdf/10.1116/1.5113631

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